| Place of Origin: | China |
|---|---|
| Brand Name: | Lensen |
| Certification: | CE |
| Layer: | 6L | Base Material: | FR4 TG170 |
|---|---|---|---|
| Board Thickness: | 1.54mm | Final Copper Thickness: | 1OZ |
| High Light: | 1OZ Copper High Density PCB,Impedance Control High Density PCB,FR4 TG170 Multilayer Circuit Board |
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High density PCB
Special Request: Blind buried via
Layer: 6L
Base Material: FR4 TG170
Board Thickness: 1.54mm
Final Copper Thickness: 1OZ
Surface Finished: ENIG
Unit Size(mm): 90.0*50.0
Panel Size(mm): 195.0*102.0
Min W/S(mil): 3.4*5.37
Min Hole Size: 0.15mm
Special Request: Impedance Control
