Layer: | Multi-layer | Color: | Red |
---|---|---|---|
Size: | Optional | Thickness: | Optional |
High Light: | multilayer printed circuit board,printed circuit board assembly |
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Details
Product name: 12-layers PCB with halfed vias and have blind and buried
Board thickness: 2.4mm
Layer: 12 layer
Surface treatment: Immersion gold
Min. circuit space:0.125/0.125mm
Minimal hole size: 0.4mm
Peculiarity: halfed vias and blind and buried vias
Ability
Item | Technical Parameters | Remarks | ||
Min. Line Width(mil) | 3/4 | Partial 3mil lines is allowed | ||
Min. Space(mil) | 3/4 | Partial 3mil lines is allowed | ||
Min. Annular Ring Width(mil) | VIAS:3mil | Remained ring width means the distance between the hole edge to the ring outskirt | ||
Component Holes: 6mils | ||||
Min. Hole Size
|
Board Thickness<2.0mm | 0.1mm | Refers to the finished hole | |
Board Thickness>=2.0mm | Aspect Ratio<=12 | Refers to the finished hole | ||
Max. Board Thickness | Single and Double Sided | 5.0mm | ||
Multilayer | 5.0mm | |||
Min. Board Thickness
|
Single and Double Sided | 0.2mm | ||
Multilayer | 4 layers:0.4mm, 6 layers: 0.7mm, 8 layers:1.1mm, 10 layers:1.6mm | |||
Max. Board Size | Single and Double Sided | 650 x 1100mm | ||
Multilayer | 650 x 1100mm | |||
Distance between Line to Board edge | Outline:0.25mm | |||
V-CUT: 0.4mm | ||||
Max. Layers | 18 layers | |||
Solder mask | Mask Window(mil) | 2/4 | ||
Mask Bridge(mil) | 6 | |||
Color | Green Yellow Red Blue White Black | |||
Legend | Min. Line Width(mil) | 5/8 | ||
Color | White, Black, Yellow, ect. | |||
Surface Plating | HAL(with Pb free), Plated Ni/Au, Ag, Imm Ni/Au, Imm Sn, Ag, OSP etc. | |||
Finished Board Thickness Tolerance: |
0.2mm<T<0.5mm: ± 0.05mm; T<0.8mm: ±10% T≥0.8mm, ±8% |